JPS63150464U - - Google Patents
Info
- Publication number
- JPS63150464U JPS63150464U JP4278587U JP4278587U JPS63150464U JP S63150464 U JPS63150464 U JP S63150464U JP 4278587 U JP4278587 U JP 4278587U JP 4278587 U JP4278587 U JP 4278587U JP S63150464 U JPS63150464 U JP S63150464U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- electric wire
- crimp terminal
- sleeve
- crimp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000002788 crimping Methods 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4278587U JPS63150464U (en]) | 1987-03-23 | 1987-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4278587U JPS63150464U (en]) | 1987-03-23 | 1987-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63150464U true JPS63150464U (en]) | 1988-10-04 |
Family
ID=30859029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4278587U Pending JPS63150464U (en]) | 1987-03-23 | 1987-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63150464U (en]) |
-
1987
- 1987-03-23 JP JP4278587U patent/JPS63150464U/ja active Pending